Finetech

Infobox Company

company_name = Finetech GmbH & Co. KG
company_
company_type = GmbH & Co. KG
foundation = 1992
location_city = Berlin
location_country = Germany
Headquarters = Berlin
key_people = Gunter Kuerbis, CEO
industry = Engineering
products = Advanced rework and micro assembly equipment
company_slogan = ...simply accurate
homepage = http://www.finetech.de

Finetech GmbH & Co. KG offers equipment solutions for various kinds of rework and micro assembly challenges, including the latest advanced packages.

Company Background

Originally founded in 1992, FINETECH entered the industry by focusing on rework equipment. Soon after, the company added flip chip assembly and die-attach equipment to its repertoire of resources.

Today, FINETECH offers a flexible approach to customer applications, and welcomes the opportunity to create customized solutions and solve problems for customer projects. FINETECH is driven by continuous innovation. The company strives to be a high-quality manufacturer in rework and micro assembly and is dedicated to improving existing solutions as well as designing new products to keep pace with new developments in the market.

Manual, semi-automatic and automatic FINEPLACER^® systems are available, and have a modular design for maximum process flexibility. Applications range from R&D and prototype environments (high-accuracy, low-volume) to more fully-automated production with higher volumes.

The core businesses of FINETECH are devoted to the fields of precision component placement, flip chip and optoelectronic bonding, and SMT rework. The company services customers in a broad range of industries including aerospace, medical technology, consumer electronics, semiconductor, optoelectronics, military and universities. FINETECH works with companies from the start-up phase to large multi-user corporations. Worldwide, the company has more than 1.500 installations.

Products

Operating worldwide, FINETECH offers equipment and application solutions for both, advanced rework challenges and micro assembly.

The product range includes different types of Fineplacer systems (manual, semi-automatic and automatic rework stations or bonding and assembly platforms) and a wide range of additional tools and modules. Depending of specific configurations, the Fineplacer systems are suitable for R&D and prototype environments (high-accuracy, low-volume) as well as for more fully-automated production with higher volumes / higher rework yields.

Major application solutions are provided for rework of small passives, BGA and CGA, QFN and MLF or single solder balls.

Furthermore, Fineplacer systems are capable of applying different bonding (i.e. wire bonding/ball bonding and adhesion technologies for MEMS / MOEMS assembly, RFID assembly and all kinds of optoelectronics assembly.

Locations

Headquarters and main production sites are located in
* Berlin, Germany, with an additional manufacturing facility in Dresden, Germany. Sales and services facilities are located in
* Tempe, Arizona
* Shanghai, China
* Kuala Lumpur, Malaysia

Certifications

FINETECH is a ISO 9001 certified company since 2004.

External links

*http://www.finetech.de (official website)
*http://www.fineplacer.com.cn (Chinese website)
*http://www.opto-bonder.com