MicroLeadFrame

MicroLeadFrame package

Amkor's MicroLeadFrame (QFN - Quad Flat No-Lead package) is a near CSP plastic encapsulated package with a copper leadframe substrate. This package uses perimeter lands on the bottom of the package to provide electrical contact to the (PWB - Printed Wiring Board). The package also offers Amkor's ExposedPad technology as a thermal enhancement by having the die attach paddle exposed on the bottom of the package surface to provide an efficient heat path when soldered directly to the PWB. This enhancement also enables stable ground by use of down bonds or by electrical connection through a conductive die attach material.

A more recent design variation which allows for higher density connections is the Dual Row MicroLeadFrame (DRMLF) package. This is an MLF package with 2 rows of lands for devices requiring up to 164 I/O. Typical applications include hard disk drives, USB controllers, and Wireless LAN.

Sources

• Amkor MicroLeadFrame (MLF)Information
• Application Notes for Surface Mount Assembly of Amkor’s MicroLeadFrame (MLF) Packages
• Application Notes for Surface Mount Assembly of Amkor’s Dual Row MicroLeadFrame (MLF) Packages
• ChipScale Review magazine, July - August 2000.]