Electroplating is the process of using electrical current to reduce
cations of a desired material from a solution and coat a conductive object with a thin layer of the material, such as a metal. Electroplating is primarily used for depositing a layer of material to bestow a desired property (e.g., abrasionand wear resistance, corrosionprotection, lubricity, aesthetic qualities, etc.) to a surface that otherwise lacks that property. Another application uses electroplating to build up thickness on undersized parts.
The process used in electroplating is called electrodeposition. It is analogous to a
galvanic cellacting in reverse. The part to be plated is the cathodeof the circuit. In one technique, the anodeis made of the metal to be plated on the part. Both components are immersed in a solutioncalled an electrolytecontaining one or more dissolved metal salts as well as other ions that permit the flow of electricity. A rectifiersupplies a direct currentto the anode, oxidizing the metal molecules that comprise it and allowing them to dissolve in the solution. At the cathode, the dissolved metal ions in the electrolyte solution are reduced at the interface between the solution and the cathode, such that they "plate out" onto the cathode. The rate at which the anode is dissolved is equal to the rate at which the cathode is plated, vis-a-vis the current flowing through the circuit. In this manner, the ions in the electrolyte bath are continuously replenished by the anode. [Dufour, IX-1.]
Other electroplating processes may use a nonconsumable anode such as lead. In these techniques, ions of the metal to be plated must be periodically replenished in the bath as they are drawn out of the solution. [Dufour, IX-2.]
The anode and cathode in the electroplating cell are both connected to an external supply of direct current - a battery or, more commonly, a rectifier. The anode is connected to the positive terminal of the supply, and the cathode (article to be plated) is connected to the negative terminal. When the external power supply is switched on, the metal at the anode is oxidized from the zero valence state to form
cations with a positive charge. These cations associate with the anions in the solution. The cations are reduced at the cathode to deposit in the metallic, zero valence state. For example, in an acid solution, copperis oxidized at the anode to Cu2+ by losing two electrons. The Cu2+ associates with the anion SO42- in the solution to form copper sulfate. At the cathode, the Cu2+ is reduced to metallic copper by gaining two electrons. The result is the effective transfer of copper from the anode source to a plate covering the cathode.
The plating is most commonly a single metallic element, not an
alloy. However, some alloys can be electrodeposited, notably brassand solder.
Many plating baths include
cyanides of other metals (e.g., potassium cyanide) in addition to cyanides of the metal to be deposited. These free cyanides facilitate anode corrosion, help to maintain a constant metal ion level and contribute to conductivity. Additionally, non-metal chemicals such as carbonates and phosphates may be added to increase conductivity.
When plating is not desired on certain areas of the substrate, stop-offs are applied to prevent the bath from coming in contact with the substrate. Typical stop-offs include tape, foil,
lacquers, and waxes. [Dufour, IX-3.]
Initially, a special plating deposit called a "strike" or "flash" may be used to form a very thin (typically less than 0.1 micrometer thick) plating with high quality and good adherence to the substrate. This serves as a foundation for subsequent plating processes. A strike uses a high current density and a bath with a low ion concentration. The process is slow, so more efficient plating processes are used once the desired strike thickness is obtained.
The striking method is also used in combination with the plating of different metals. If it is desirable to plate one type of deposit onto a metal to improve corrosion resistance but this metal has inherently poor adhesion to the substrate, a strike can be first deposited that is compatible with both. One example of this situation is the poor adhesion of electrolytic
nickelon zincalloys, in which case a copper strike is used, which has good adherence to both. [Dufour, IX-2.]
The current density (amperage of the electroplating current divided by the surface area of the part) in this process strongly influences the deposition rate, plating adherence, and plating quality. This density can vary over the surface of a part, as outside surfaces will tend to have a higher current density than inside surfaces (e.g., holes, bores, etc.). The higher the current density, the faster the deposition rate will be, although there is a practical limit enforced by poor adhesion and plating quality when the deposition rate is too high.
While most plating cells use a continuous direct current, some employ a cycle of 8–15 seconds on followed by 1–3 seconds off. This technique is commonly referred to as "pulse plating" and allows high current densities to be used while still producing a quality deposit. In order to deal with the uneven plating rates that result from high current densities, the current is even sometimes reversed in a method known as "pulse-reverse plating", causing some of the plating from the thicker sections to re-enter the solution. In effect, this allows the "valleys" to be filled without over-plating the "peaks". This is common on rough parts or when a bright finish is required. [Ibid.] In a typical pulse reverse operation, the reverse current density is three times greater than the forward current density and the reverse pulse width is less than one-quarter the forward pulse width. Pulse-reverse processes can be operated at a wide range of frequencies from several hundred hertz up to the order of megahertz.
A closely-related process is brush electroplating, in which localized areas or entire items are plated using a brush saturated with plating solution. The brush, typically a
stainless steelbody wrapped with a cloth material that both holds the plating solution and prevents direct contact with the item being plated, is connected to the positive side of a low voltage direct-current power source, and the item to be plated connected to the negative. The operator dips the brush in plating solution then applies it to the item, moving the brush continually to get an even distribution of the plating material. The brush acts as the anode, but typically does not contribute any plating material, although sometimes the brush is made from or contains the plating material in order to extend the life of the plating solution.
Brush electroplating has several advantages over tank plating, including portability, ability to plate items that for some reason cannot be tank plated (one application was the plating of portions of very large decorative support columns in a building restoration), low or no masking requirements, and comparatively low plating solution volume requirements. Disadvantages compared to tank plating can include greater operator involvement (tank plating can frequently be done with minimal attention), and inability to achieve as great a plate thickness..
electrolytic cell(consisting of two electrodes, electrolyte, and external source of current) is used for electrodeposition. In contrast, an electroless deposition process uses only one electrode and no external source of electrical current. However, the solution for the electroless process needs to contain a reducing agent so that the electrode reaction has the form::
For example, an electroless process is used for
electroless nickel plating.
Cleanliness is essential to successful electroplating, since molecular layers of oil can prevent adhesion of the coating.
ASTMB322 is a standard guide for cleaning metals prior to electroplating. Cleaning processes include solvent cleaning, hot alkaline detergent cleaning, electrocleaning, and acid etc. The most common industrial test for cleanliness is the waterbreak test, in which the surface is thoroughly rinsed and held vertical. Hydrophobic contaminants such as oils cause the water to bead and break up, allowing the water to drain rapidly. Perfectly clean metal surfaces are hydrophilic and will retain an unbroken sheet of water that does not bead up or drain off. ASTM F22 describes a version of this test. This test does not detect hydrophilic contaminants, but the electroplating process can displace these easily since the solutions are water-based. Surfactants such as soap reduce the sensitivity of the test and must be thoroughly rinsed off.
Obtaining a uniform thickness with electroplating can be difficult depending on the geometry of the object being plated. The plating metal is preferentially attracted to external corners and protrusions, but unattracted to internal corners and recesses. These difficulties can be overcome with multiple anodes or a specially shaped anode that mimics the object geometry, however both of these solutions increase cost. [Citation | last = Degarmo | first = E. Paul | last2 = Black | first2 = J. T. | last3 = Kohser | first3 = Ronald A. | title = Materials and Processes in Manufacturing | publisher = Wiley | page = 794 | year = 2003 | edition = 9th | isbn = 0-471-65653-4.]
Modern electrochemistry was invented by Italian chemist
Luigi V. Brugnatelliin 1805. Brugnatelli used his colleague Alessandro Volta's invention of five years earlier, the voltaic pile, to facilitate the first electrodeposition. Brugnatelli's inventions were repressed by the French Academy of Sciencesand did not become used in general industry for the following thirty years.
By 1839, scientists in Britain and
Russiahad independently devised metal deposition processes similar to Brugnatelli's for the copper electroplating of printing pressplates. Soon after, John Wright of Birmingham, Englanddiscovered that potassium cyanidewas a suitable electrolytefor gold and silver electroplating. Wright's associates, George Elkingtonand Henry Elkington were awarded the first patents for electroplating in 1840. These two then founded the electroplating industry in Birminghamfrom where it spread around the world.
As the science of
electrochemistrygrew, its relationship to the electroplating process became understood and other types of non-decorative metal electroplating processes were developed. Commercial electroplating of nickel, brass, tin, and zinc were developed by the 1850s. Electroplating baths and equipment based on the patents of the Elkingtons were scaled up to accommodate the plating of numerous large scale objects and for specific manufacturing and engineering applications.
The plating industry received a big boost from the advent of the development of
electric generators in the late 19th century. With the higher currents, available metal machine components, hardware, and automotiveparts requiring corrosion protection and enhanced wear properties, along with better appearance, could be processed in bulk.
The two World Wars and the growing
aviationindustry gave impetus to further developments and refinements including such processes as hard chromium plating, bronzealloy plating, sulfamate nickel plating, along with numerous other plating processes. Plating equipment evolved from manually operated tar-lined wooden tanks to automated equipment, capable of processing thousands of kilograms per hour of parts.
One of the American physicist
Richard Feynman's first projects was to develop technology for electroplating metal onto plastic. Feynman developed the original idea of his friend into a successful invention, allowing his employer (and friend) to keep commercial promises he had made but could not have fulfilled otherwise. [Richard Feynman, "Surely You're Joking, Mr. Feynman!" (1985), in chap. 6: "The Chief Research Chemist of the Metaplast Corporation"]
Electroplating is one of the three processes that form the
LIGA-process used to manufacture MEMSdevices.
last = Dufour
first = Jim
title = An Introduction to Metallurgy, 5th ed
publisher = Cameron
date = 2006
* cite book
first = James B.
last = Mohler
year = 1969
title = Electroplating and Related Processes
publisher = Chemical Publishing Co.
id = ISBN 0-8206-0037-7
* [http://electrochem.cwru.edu/ed/encycl/art-e01-electroplat.htm Electrochemistry Encyclopedia article]
Wikimedia Foundation. 2010.