Die (integrated circuit)

Die (integrated circuit)
A Cell processor die
A VLSI integrated-circuit die
A small-scale integrated circuit die, with bond wires attached.

A die in the context of integrated circuits is a small block of semiconducting material, on which a given functional circuit is fabricated. Typically, integrated circuits are produced in large batches on a single wafer of electronic-grade silicon (EGS) or other semiconductor (such as GaAs) through processes such as photolithography. The wafer is cut (“diced”) into many pieces, each containing one copy of the circuit. Each of these pieces is called a die.

There are three commonly used plural forms: dice, dies, and die.[1][2]

See also

References

  1. ^ John E. Ayers (2004). Digital Integrated Circuits. CRC Press. ISBN 084931951X. http://books.google.com/books?id=QHtalNXHKbsC&pg=PA31&dq=die+dice+dies+plural+wafer&lr=&as_brr=3&ei=hakESZTiJJGssgO9yNGqBA. 
  2. ^ Robert Allen Meyers (2000). Encyclopedia of Physical Science and Technology. Academic Press. ISBN 0122269306. http://books.google.com/books?id=C4gyAAAAMAAJ&q=chips+dies+plural+wafer&dq=chips+dies+plural+wafer&lr=&as_brr=0&ei=T7EESY_gDIPytQPkq8SzDA&pgis=1. 
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