Integrated circuit encapsulation
- Integrated circuit encapsulation
Integrated circuit encapsulation (IC encapsulation, encapsulation) is the design and manufacturing of protective packages for integrated circuits.
It is often the last stage of IC packaging (semiconductor package assembly) in semiconductor device fabrication. The integrated circuit die is being encapsulated with ceramic, plastic, or epoxy to prevent physical damage or corrosion.
Sometimes the term "encapsulation" is used synonymously to "packaging".
See also
* Potting (electronics)
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Integrated circuit packaging — Early USSR made integrated circuit Integrated circuit packaging is the final stage of semiconductor device fabrication per se, followed by IC testing.Packaging in ceramic or plastic prevents physical damage and corrosion and supports the… … Wikipedia
integrated circuit packaging — integrinio grandyno surinkimas į korpusą statusas T sritis radioelektronika atitikmenys: angl. integrated circuit packaging; microelectronic packaging vok. mikroelektronische Kapselung, f rus. сборка интегральной схемы в корпус, f pranc. micro… … Radioelektronikos terminų žodynas
plastic-encapsulated integrated circuit — integrinis grandynas su plastikiniu korpusu statusas T sritis radioelektronika atitikmenys: angl. plastic encapsulated integrated circuit; plastic packaged integrated circuit vok. integrierter Schaltkreis im Plastgehäuse, m rus. интегральная… … Radioelektronikos terminų žodynas
plastic-packaged integrated circuit — integrinis grandynas su plastikiniu korpusu statusas T sritis radioelektronika atitikmenys: angl. plastic encapsulated integrated circuit; plastic packaged integrated circuit vok. integrierter Schaltkreis im Plastgehäuse, m rus. интегральная… … Radioelektronikos terminų žodynas
Encapsulation — Wiktionarypar|encapsulationEncapsulation may refer to: * molecular encapsulation, in chemistry, the confinement of an individual molecule within a larger molecule * encapsulation (networking), in computer networking, to include data from an upper … Wikipedia
circuit intégré à encapsulation par plastique — integrinis grandynas su plastikiniu korpusu statusas T sritis radioelektronika atitikmenys: angl. plastic encapsulated integrated circuit; plastic packaged integrated circuit vok. integrierter Schaltkreis im Plastgehäuse, m rus. интегральная… … Radioelektronikos terminų žodynas
circuit intégré en boîtier plastique — integrinis grandynas su plastikiniu korpusu statusas T sritis radioelektronika atitikmenys: angl. plastic encapsulated integrated circuit; plastic packaged integrated circuit vok. integrierter Schaltkreis im Plastgehäuse, m rus. интегральная… … Radioelektronikos terminų žodynas
micro-encapsulation — integrinio grandyno surinkimas į korpusą statusas T sritis radioelektronika atitikmenys: angl. integrated circuit packaging; microelectronic packaging vok. mikroelektronische Kapselung, f rus. сборка интегральной схемы в корпус, f pranc. micro… … Radioelektronikos terminų žodynas
Potting (electronics) — In electronics, potting is a process of filling a complete electronic assembly with a solid compound for resistance to shock and vibration, and for exclusion of moisture and corrosive agents. Thermosetting plastics are often used.Most circuit… … Wikipedia
Microelectromechanical system oscillator — Microelectromechanical system (MEMS) oscillators are timing devices that generate highly stable reference frequencies. These reference frequencies are used to sequence electronic systems, manage data transfer, define radio frequencies, and… … Wikipedia
