Socket B

CPU socket
name = Socket B


formfactors = Flip-chip land grid array | contacts = 1366
type = LGA
protocol = Intel QuickPath Interconnect
core bus = 4800 MT/s, 6400 MT/s
fsb = 1× to 2× Quickpath
voltage =
processors = Intel Nehalem CPU's:
"Bloomfield"
"Gainestown"
"Westmere"

Socket B, also known as LGA1366, will supersede Intel's desktop Socket T (commonly referred as LGA775) in the high-end and performance desktop segments, also replacing server oriented Socket J (LGA771) in the entry level.

LGA stands for Land Grid Array. Like in its predecessor, the motherboard will have no holes, but pins which touch contact points on the underside of the CPU.

Available information circulating in the specialized web sites share views that higher standards of server mainboards will be equipped with a new 1567-contact LGA and that for mainstream and entry level desktops, Intel will offer a LGA socket with 1160 contacts, [cite web |url=http://www.theregister.co.uk/2007/11/26/intel_cpu_integrated_gpus_in_09/ |title=Intel to debut GPU-in-CPU chips in 2009 |publisher=The Register |date=November 26, 2007 |accessdate=2008-06-13] creating a new 3-way segmentation of the CPU sockets offering (LGA 1160, LGA 1366 and LGA 1567).

The only future Intel CPU socket with accurate and factual information available is Socket B (LGA1366). Test boards were presented in the first quarter of 2008, as well as the CPUs themselves. [cite web |url=http://xtreview.com/addcomment-id-4599-view-Foxconn-LGA-1366-motherboard.html |title=Today appeared the new photographs of motherboard with LGA 1366 socket. |publisher=Xtreview |date=March 20 2008 |accessdate=2008-06-13]

The increase in the number of contact points is proportionally similar to the leap between LGA 775 and its predecessor PGA 478, thus an increase in the CPU size of about 20% despite pins being thinner and closer to each others. As in the previous leap, old heatsinks will be incompatible with the new boards. [cite web |url=http://news.softpedia.com/news/The-New-Nehalems-Socket-LGA-1366-under-the-scope-82646.shtml |title=The New Nehalems: Socket LGA 1366 under the scope - This means you have to change every piece of hardware to enjoy them |publisher=Softpedia |date=April 7, 2008 |accessdate=2008-06-13]

Expecting a high TDP in Nehalem CPUs, [cite web |url=http://xtreview.com/addcomment-id-5515-view-bloomfield-TDP-and-performance.html |title=BLOOMFIELD TDP AND PERFORMANCE |publisher=Xtreview|date=June 11, 2008 |accessdate=2008-06-13] Intel designed Socket B with a more solid structure, featuring a metal plate in the backside of the mainboard, tightly fastening the CPU socket with four metal screws, so that large and heavy cooling solutions will not strain, bend or damage both socket and the board.

This new socket also features a new loading mechanism to render the CPU assembly easier.

Intel X58 (codename "Tylersburg") is the first Intel chipset to feature the new 1366-contact Socket B. [cite web |url=http://www.bit-tech.net/news/2008/05/30/nehalem-and-x58-show-up-in-taipei/ |title=What chips may come: Nehalem and X58 show up in Taipei |publisher=Bit-Tech |date=May 30, 2008 |accessdate=2008-06-13]

ee also

* CPU Socket
* Nehalem (microarchitecture)
* Intel X58

References