- Molded Interconnect Device
-
A Molded Interconnect Device is an injection molded thermoplastic part with integrated electronic circuit traces. The use of high temperature thermoplastics and their structured metallization opens a new dimension of circuit carrier design to the electronics industry.[1]. This technology combines plastic substrate/housing with circuitry into a single part through selective metallization.
Contents
Applications
Key markets for the MID technology are consumer electronic, telecommunication, automotive and medical. A very common application for MIDs are integrated antennas in cellphones[2] and other mobile devices including laptops and netbooks.[3]
Manufacturing methods
Molded Interconnect Devices are typically manufactured in these technologies:
- Laser Direct Structuring (LDS)
The LDS process uses a thermoplastic material, doped with a metal-plastic additive activated by means of laser. The basic component is single-component injection molded, with practically no restrictions in terms of 3D design freedom. A laser then writes the course of the later circuit trace on the plastic. Where the laser beam hits the plastic the metall additive forms a micro-rough track. The metal particles of this track form the nuclei for the subsequent metallization. In an electroless copper bath the conductor path layers arise precisely on these tracks. Successively layers of copper, nickel and gold finish can be raised in this way.
The LDS process is characterized by
- single-component injection molding
- a wide range of materials is available
- full three-dimensionality in a sphere
- flexibility: for a changed routing of traces, only new control data have to be transmitted to the laser unit. Thus different functional components can be produced from one basic unit
- precision: finest conductor pathes with a diameter of < 80 micrometres are possible
The LDS process is patented by LPKF Laser & Electronics AG
- Two Shot Molding
Two shot molding[4] is an injection molding process using two different resins and only one of the two resins is platable. Typically the platable substrate is ABS and the non-platable substrate is polycarbonate. In a two shot component, these are then submitted to an electroless plating process where the butadiene [5] is used to chemically roughen the surface and allow adhesion of a copper primary layer. The plating chemistry can be controlled to prevent the roughening of the polycarbonate portions of the component. While not commonly found out side of cellphone antenna production, this technology is public and widely available.
External links
- TNO.nl/mid Independent research organisation which supports and develops MID production processes for external parties.
- LPKFUSA.com/MID Further information about the LDS process
- 3D-MID.de
- TycoElectronics.com/MID
- ArlingtonPlating.com
- devicelink.com/mpmn/archive/10/04/014.html
- phillipsplastics.com/case_studies/case-studies/multi-shot-holds-it-all-together
References
- ^ "3D-MID". http://www.3d-mid.de/cms/front_content/php?changelang=2&changelang=2&idcat=5&idart=5.
- ^ "Molex Produces 20 Millionth Antenna with LDS Technology". http://www.molex.com/cmc_upload/0/000/448/950/20-millionth_antenna.html.
- ^ "Tyco Electronics". http://www.tycoelectronics.com/mid/.
- ^ "MIDs Make a Comeback". http://www.ptonline.com/articles/200506fa1.html.
- ^ "Metallizing". http://en.wikipedia.org/wiki/Metallizing.
Categories:- Electrical signal connectors
Wikimedia Foundation. 2010.
