Dicing tape

Dicing tape is a backing tape used during wafer dicing, the cutting apart of pieces of semiconductor material following wafer microfabrication. The tape holds the pieces of semiconductor, known as dies, together during the cutting process, mounting them to a thin metal frame. The dies are later removed from the dicing tape further on in the electronics manufacturing process.

Dicing tape can be made of PVC, polyolefin, or polyethylene backing material with an adhesive to hold the dies in place. It is available in a variety of thicknesses, from 75 ^[1] to 150 micrometers, with a variety of adhesive strengths, designed for various chip sizes and materials. UV tapes are dicing tapes in which the adhesive bond is broken by exposure to UV light after dicing, allowing the adhesive to be stronger during cutting while still allowing clean and easy removal.^[2]

References

1. ^ http://www.semicorp.com/products/standardDicingTape.html "Standard Dicing Tape." Semiconductor Equipment Corp. Accessed 23 July 2010
2. ^ http://www.semiconductortapes.com/products/difference2.html "UV Tape vs Non-UV Tape." Semiconductor Tapes and Materials. Accessed 23 July 2010