Organic Solderability Preservative, or OSP is a method for plating printed circuit boards. It uses a water-based organic compound that selectively bonds to copper and provides an organometallic layer that protects the copper during soldering.
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Organic Surface Protection — (OSP, deutsch organischer Oberflächenschutz) ist ein Verfahren der Aufbau und Verbindungstechnik, um die Oberfläche von Leiterplatten während des Lötvorgangs zu schützen. Diese Schicht besteht aus in Wasser gelösten, organischen Verbindungen … Deutsch Wikipedia
Plating — describes surface covering where a metal is deposited on a conductive surface. Plating has been done for hundreds of years, but it is also critical for modern technology. Plating is used to decorate objects, for corrosion inhibition, to improve… … Wikipedia
OSP — may refer to: Names Osp, a valley and a village in Slovenia Acronyms Independent Socialist Party (Netherlands) (Dutch:Onafhankelijke Socialistische Partij) obiit sine prole, Latin phrase meaning died without offspring Oblate Sisters of Providence … Wikipedia
OSP — Outside Plant (Computing » Telecom) *** Oregon State Police (Governmental » Police) * Off Street Parking (Community) * Orange Smoothie Productions (Business » Firms) * Outer Surface Protein (Medical » Human Genome) * Open Settlement Protocol… … Abbreviations dictionary
