Resputtering

Resputtering: Resputtering involves re-emission of material, e.g., SiO₂, deposited by sputtering during the deposition. Similar to sputtering, the re-emission is caused by ion bombardment of the deposited material. The resputtering technique was first published by L.I. Maissel et al. in the "Journal of Applied Physics" (Jan. 1965, p. 237) and was called Biased Sputtering.

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Sputter deposition — is a physical vapor deposition (PVD) method of depositing thin films by sputtering, that is ejecting, material from a target, that is source, which then deposits onto a substrate, such as a silicon wafer. Resputtering is re emission of the… … Wikipedia
Sputtering — is a process whereby atoms are ejected from a solid target material due to bombardment of the target by energetic ions. It is commonly used for thin film deposition, etching and analytical techniques (see below). Physics of sputtering Physical… … Wikipedia

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