Thermal interface material
- Thermal interface material
A Thermal Interface Material or Mastic (aka TIM) is used to fill the gaps between thermal transfer surfaces, such as between microprocessors and heatsinks, in order to increase thermal transfer efficiency. These gaps are normally filled with air which is a very poor conductor.
They take many forms. The most common is the white-colored paste or thermal grease, typically silicone oil filled with aluminum oxide, zinc oxide, or boron nitride. Some brands of thermal interfaces use micronized or pulverized silver.
Another type of TIM are the phase-change materials. These are solid at room temperature but liquefy and behave like grease at operating temperatures. They are easy to handle and are not messy.
External links
[http://www.aitechnology.com/products/thermalinterface/thermelec/ AI Technology - Compressible Phase Change Thermal Interface Materials]
[http://www.bergquistcompany.com Bergquist - Thermal Interface Materials]
[http://www.fabrico.com EIS - Thermal Interface Materials]
[http://www.fraivillig.com Fraivillig Technologies - Thermal Interface Materials]
[http://www.fujipoly.com/products/genProductLine.asp? Fujipoly - Thermal Interface Materials Product Line=Sarcon_Thermal_Interface_Materials]
[http://www.lairdtech.com/pages/products/Thermal-Interface-Materials.asp Laird Technologies - Complete line of Phase Change Materials, Thermal Grease, Gap Fillers, and Thermally Conductive Insulators]
Take note that some cpu's should have thermal paste applied and some should not. AMD has a white paper about this in regard of their own cpu's: http://www.amd.com/us-en/assets/content_type/white_papers_and_tech_docs/26951.pdf
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