Bahgat G. Sammakia

Bahgat G. Sammakia is an Egyptian-American mechanical engineer. He is currently a professor of mechanical engineering and director of both the Integrated Electronics Engineering Center and the Small Scale Systems Packaging Center at Binghamton University a part of the State University of New York (SUNY) system. Dr. Sammakia has published over 80 technical papers in refereed journals and conference proceedings, holds 13 U.S. patents and 12 IBM technical disclosures. He has also contributed to three books [https://portal.rfsuny.org/portal/page?_pageid=1307,1622652&_dad=portal&_schema=PORTAL] .

Education and career

Dr. Sammakia received his B.S. degree in 1977 from the University of Alexandria. He received his M.S. and Ph.D. degrees in 1980 and 1982, respectively from the State University of New York at Buffalo. All of his degrees are in mechanical engineering [ [http://me.binghamton.edu/level2-1/faculty/Sammakia.html Bahgat Sammakia ] ] . The title of his doctoral dissertation is "Transient natural and mixed convection flows and transport adjacent to an ice surface melting in saline water" [ [http://wwwlib.umi.com/dxweb/details?doc_no=135078 UMI Dissertation Express - Browser Config! ] ] .

After completing his Ph.D., Dr. Sammakia was a postdoctoral fellow at the University of Pennsylvania. He began working for IBM in 1984 as an engineer. He continued to work for IBM until 1998, holding various management positions during that time. Some of the groups that he managed at IBM include the thermal and mechanical analysis groups, the surface science group, the chemical lab, and the site technical assurance group [ [http://www.ieec.binghamton.edu/ieec/staff/bahgat.htm IEEC - Bahgat Sammakia - Director ] ] .

He was honored by the Chancellor of the State University of New York in 2002 for research excellence [ [http://inside.binghamton.edu/September-October/31oct02/awards.html Inside Binghamton University ] ] .

Dr. Sammakia was the Interim Vice President for Research at Binghamton University from July 2003 until July 2004 [ [http://research.binghamton.edu/faculty/Sammakia/Sammakia.htm Faculty Spotlight - Dr. Bahgat Sammakia ] ] .

Dr. Sammakia is the editor of the Journal of Electronics Packaging, which is published by the American Society of Mechanical Engineers [ [http://journaltool.asme.org/Content/Masthead5.cfm Journals Publications ] ] .

Patents

[http://patft1.uspto.gov/netacgi/nph-Parser?patentnumber=7282254 7,282,254] Surface coating for electronic systems

[http://patft1.uspto.gov/netacgi/nph-Parser?patentnumber=6219234 6,219,234] Method for using pulsating flow to improve thermal transport in systems

[http://patft1.uspto.gov/netacgi/nph-Parser?patentnumber=6058015 6,058,015] Electronic packages and a method to improve thermal performance of electronic packages

[http://patft1.uspto.gov/netacgi/nph-Parser?patentnumber=5966290 5,966,290] Electronic packages and a method to improve thermal performance of electronic packages

[http://patft1.uspto.gov/netacgi/nph-Parser?patentnumber=5912800 5,912,800] Electronic packages and method to enhance the passive thermal management of electronic packages

[http://patft1.uspto.gov/netacgi/nph-Parser?patentnumber=5870285 5,870,285] Assembly mounting techniques for heat sinks in electronic packaging

[http://patft1.uspto.gov/netacgi/nph-Parser?patentnumber=5491610 5,491,610] Electronic package having active means to maintain its operating temperature constant

[http://patft1.uspto.gov/netacgi/nph-Parser?patentnumber=5420520 5,420,520] Method and apparatus for testing of integrated circuit chips

[http://patft1.uspto.gov/netacgi/nph-Parser?patentnumber=5109318 5,109,318] Pluggable electronic circuit package assembly with snap together heat sink housing

[http://patft1.uspto.gov/netacgi/nph-Parser?patentnumber=5028984 5,028,984] Epoxy composition and use thereof

[http://patft1.uspto.gov/netacgi/nph-Parser?patentnumber=5003429 5,003,429] Electronic assembly with enhanced heat sinking

[http://patft1.uspto.gov/netacgi/nph-Parser?patentnumber=4914551 4,914,551] Electronic package with heat spreader member

[http://patft1.uspto.gov/netacgi/nph-Parser?patentnumber=4849856 4,849,856] Electronic package with improved heat sink

Book

*

elected Papers

*cite journal
last = Arunasalam P, Ackler HD, Sammakia BG
first =
authorlink =
coauthors =
title = Microfabrication of ultrahigh density wafer-level thin film compliant interconnects for through-silicon-via based chip stacks
journal = Journal of Vacuum Science & Technology B
volume = 24
issue = 4
pages = 1780–1784
publisher =
date= Jul-Aug 2006
url =
doi = 10.1116/1.2210003
id =
accessdate =

*cite journal
last = Desai A, Geer J, Sammakia B
first =
authorlink =
coauthors =
title = Models of steady heat conduction in multiple cylindrical domains
journal = Journal of Electronic Packaging
volume = 128
issue = 1
pages = 10–17
publisher =
date= Mar 2006
url = http://scitation.aip.org/journals/doc/JEPAE4-ft/vol_128/iss_1/10_1.html
doi = 10.1115/1.2159003
id =
accessdate =

*cite journal
last = Desai A, Mahajan S, Subbarayan G, Jones W, Geer J, Sammakia B
first =
authorlink =
coauthors =
title = A numerical study of transport in a thermal interface material enhanced with carbon nanotubes
journal = Journal of Electronic Packaging
volume = 128
issue = 1
pages = 92–97
publisher =
date= Mar 2006
url = http://scitation.aip.org/journals/doc/JEPAE4-ft/vol_128/iss_1/92_1.html
doi = 10.1115/1.2161231
id =
accessdate =

*cite journal
last = Watson SP, Murray BT, Sammakia BG
first =
authorlink =
coauthors =
title = Computational parameter study of chip scale package array cooling
journal = IEEE Transactions on Components and Packaging Technologies
volume = 24
issue = 2
pages = 184–190
publisher = IEEE
date= Jun 2001
url = http://ieeexplore.ieee.org/iel5/6144/20041/00926381.pdf?tp=&arnumber=926381&isnumber=20041
doi = 10.1109/6144.926381
id =
accessdate =

*cite journal
last = Sathe SB, Sammakia BG
first =
authorlink =
coauthors =
title = A numerical study of the thermal performance of a tape ball grid array (TBGA) package
journal = Journal of Electronic Packaging
volume = 122
issue = 2
pages = 107–114
publisher = ASME
date= Jun 2000
url = http://scitation.aip.org/journals/doc/JEPAE4-ft/vol_122/iss_2/107_1.html
doi = 10.1115/1.483141
id =
accessdate =

*cite journal
last = Niu TM, Sammakia BG, Sathe S
first =
authorlink =
coauthors =
title = Void-effect modeling of flip-chip encapsulation on ceramic substrate
journal = IEEE Transactions on Components and Packaging Technologies
volume = 22
issue = 4
pages = 484–487
publisher = IEEE
date= Dec 1999
url = http://ieeexplore.ieee.org/iel5/6144/17642/00814962.pdf?tp=&arnumber=814962&isnumber=17642
doi = 10.1109/6144.814962
id =
accessdate =

*cite journal
last = Tran SK, Questad DL, Sammakia BG
first =
authorlink =
coauthors =
title = Adhesion issues in flip-chip on organic modules
journal = IEEE Transactions on Components and Packaging Technologies
volume = 22
issue = 4
pages = 519–524
publisher = IEEE
date= Dec 1999
url = http://ieeexplore.ieee.org/iel5/6144/17642/00814967.pdf?tp=&arnumber=814967&isnumber=17642
doi = 10.1109/6144.814967
id =
accessdate =

*cite journal
last = Sathe S, Sammakia B
first =
authorlink =
coauthors =
title = A review of recent developments in some practical aspects of air-cooled electronic packages
journal = Journal of Heat Transfer-Transactions of the ASME
volume = 120
issue = 4
pages = 830–839
publisher = ASME
date= November 1998
url =
doi =
id =
accessdate =

External links

* [http://www.ieec.binghamton.edu/ieec/ The Integrated Electronics Engineering Center]

References