Quilt packaging

Quilt packaging is an electronic packaging technology under research that allows microchips made of dissimilar materials to be attached like squares in a quilt. Chips are connected in a way that minimizes both thermal stress and interchip delay times. The reflection coefficient s11 has been measured at less than -25dB at 40GHz in high resistivity silicon. Connections between microchips are made by thin metal lines which extend over the edge of each chip.

The current process involves the etching and deposition of silicon dioxide, evaporating and electroplating of thick copper bumps, Chemical-mechanical planarization of the copper, and the advanced silicon etch process to separate into individual chips with undercut metal nodules extending off the edges. The nodules can be joined together using ordinary lead-free soldering. ["Quilt packaging research website" http://nd.edu/~kander19/QP/QuiltPackaging.htm ]

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